Smiths Interconnect announces significant contract win

Smiths Interconnect, a leading provider of innovative solutions for critical semiconductor test applications, and a business of Smiths, is pleased to announce that its patented, state-of-the-art DaVinci Gen V test sockets have been selected as the exclusive test socket solution by a major global provider of high-performance computing and artificial intelligence semiconductor chips.

This strategic contract supports the customer’s upcoming global launch of their next-generation AI semiconductor chips, designed for data centre GPU applications. These GPUs are engineered to accelerate deep learning, artificial neural networks, and high-performance computing workloads.

Smiths Interconnect’s DaVinci Gen V sockets will play a critical role in the manufacturing test process, ensuring ultra-reliable and repeatable performance of the chips prior to deployment. This selection underscores the superior performance, innovation, and reliability of Smiths Interconnect’s test socket technology.

The award builds on a successful collaboration initiated in 2024, when Smiths Interconnect supported the customer’s previous AI chip programme. This latest win marks a significant expansion of the partnership and reinforces Smiths Interconnect’s position as a trusted technology partner in the semiconductor industry.

Brian Mitchell, Vice President of Smiths Interconnect’s semiconductor test business unit, said: "Our goal is to provide the fastest, most reliable test with the greatest precision, to meet the demands of semiconductor manufacturers in a fast-moving technological environment. We are proud to grow our relationship with such a world-class company and proud that they trust us to test and validate their products which are integral to so many aspects of modern computing."

Smiths Interconnect’s test sockets play a critical role in testing semiconductor chips, otherwise known as ‘AI chips’, which are deployed in a range of areas such as automotive systems, robotics, large language models, computer gaming and 6G communications networks. 

As AI becomes ever more sophisticated, the need for higher processing power, speed and efficiency in computers has grown — and AI chips are essential for meeting this demand. The testing of these products to ensure reliability, repeatability and longevity, is therefore of crucial importance.

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About Smiths Interconnect

Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave, optical and radio frequency products that connect, protect and control critical applications in the commercial aviation, defence, space, medical, rail, semiconductor test, wireless telecommunications, and industrial market segments. Smiths Interconnect is synonymous with exceptional performance whenever a technologically advanced, high-quality solution is required to ensure reliability and safety.

Smiths Interconnect is part of Smiths. For over 170 years, Smiths has been pioneering progress by engineering a better future. We serve millions of people every year, to help create a safer, more efficient, and better-connected world, across four global markets: Energy, General Industry, Safety & Security, and Aerospace. Listed on the London Stock Exchange, Smiths employs more than 15,000 colleagues in over 50 countries. For more information visit www.smiths.com.